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Electroless Plating

Support for chemical plating stability on complex shapes and special substrates.

Overview

These processes are reviewed through substrate activation, bath stability, and practical operating checks.

Applicable Materials

  • Metal parts
  • PCB-related substrates
  • Plastics
  • Complex components

Applicable Processes

  • Electroless nickel
  • Electroless copper
  • Substrate activation
  • Immersion treatment

Key Control Items

  • pH
  • Temperature
  • Metal concentration
  • Reducing agent status
  • Bath stability

PLACHEM Technical Support

  • Substrate suitability review
  • Bath checklist
  • Sample test planning

Technical Inquiry

Prepare process, material, symptom, and document details for technical review.

Electroless inquiry